Inspeção de Pasta de Solda 3D SPI
With its revolutionnary warp measurement, this system provides unmatched accuracy for 100% 3D Solder Paste Inspection.
Vi TECHNOLOGY ®'s 3D-SPI is the world's first 3D Solder paste inspection system able to measure PCB warp as well as true solder volume without shadow effect within cycle time. On-the fly 3D image acquisition (instead of stop and move) brings faster 3D inspection without loss of resolution.
Accuracy and warp compensation
- Unmatched true resolution, accuracy and repeatability
- Full-featured absolute measurement of the full board surface, mapping to 0.1µm for every measurement
- Zero % shadow effect with the structured double light source providing no volume measurement error
- True volume measurement of board and paste
- Unique flexible board process measurement
- Easy off-line programming by automatic conversion of Gerber and CAD Data
- Easy- to-use, highly flexible software
- On-machine defect review and trend analysis
- Real-time process monitoring and alarm signal generation
- Real-time SPC software for process monitoring and defect analysis
- Full-featured historical drill down of data with intuitive presentation of information
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